The University of Tokyo has successfully developed a new technology for laser micro-hole processing of glass substrates
Recently, the University of Tokyo announced the successful development of a "laser micro-hole processing technology" for the next generation of semiconductor glass substrates, which can achieve high-precision, extremely small aperture and high aspect ratio micro-hole processing on glass materials. The glass substrate used in the experiment is "EN-A1" produced by AGC.
With the help of ultra-short pulse deep ultraviolet lasers, the team has achieved micron-level precision processing of glass materials-the diameter of the penetration hole is less than 10 microns, and the aspect ratio can reach 20:1. Previously, it was difficult to prepare high-aspect ratio hole structures based on acidic solution etching processes, and deep ultraviolet laser direct processing technology not only broke through this bottleneck, but also achieved crack-free high-quality hole processing. In addition, this process does not require chemical treatment steps, which can significantly reduce the environmental burden caused by liquid waste treatment.
Microscopic images of micropores drilled on EN-A1 glass from above and side
This achievement is an important milestone in the post-processing technology of next-generation semiconductor manufacturing. As the substrate core material and interposer material transition to glass-based, this technology provides a key solution for through-hole processing of glass substrates. In the future, it is expected to promote the development of semiconductor devices towards smaller size and higher integration complexity in chiplet technology.
